Technical Module Owner (f/m/x)

ZEISS Semiconductor Manufacturing Technology​

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Enabler for smaller, more powerful, and more energy-efficient microchips​

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Working for tomorrow today. ​

Around 80 percent of all microchips worldwide are produced using ZEISS technologies. As the centerpiece of every electronically controlled system, they have become an integral part of our everyday lives – whether in smartphones, smart homes or smart factories. ZEISS is a technology leader in the field of semiconductor manufacturing equipment. With high-precision lithography optics, photomask systems and process control solutions, ZEISS enables the production of ever smaller, increasingly powerful, and more energy-efficient microchips, and thus plays a pivotal role in the age of micro- and nanoelectronics.

Your role

• take module ownership for camera components within a high-precision machine for mask metrology
• coordinate interdisciplinary development activities across camera hardware, electronics, firmware & software, metrology algorithms, controls and system integration
• starting from module requirements and interfaces, define design, verification plans and acceptance criteria for camera functionalities and information to be processed and sent to other modules
• plan and steer technical work packages, milestones, risks, dependencies, design reviews, integration steps and documentation deliverables for the assigned modules
• ensure technical consistency between camera acquisition, calibration, data handling, metrology processing and machine-level performance budgets
• drive integration, commissioning and issue resolution together with internal experts, suppliers and project stakeholders, ensuring transparent status, priorities and decisions

Your profile

• a university degree in electrical engineering, mechatronics, computer science, physics or a comparable technical field
• technical understanding of camera-based inspection systems, image acquisition chains, calibration concepts, metrology and high-precision machine integration
• experience in coordinating complex module development across hardware, software, algorithms, electronics and metrology disciplines
• good knowledge of requirements engineering, interface management, verification planning, error budgeting, technical risk management and structured decision preparation
• strong project coordination skills, including milestone planning, dependency tracking, stakeholder alignment, backlog prioritization and escalation of technical impediments
• experience working with suppliers and internal development partners on camera hardware, test setups, prototype builds, data flows, commissioning and troubleshooting
• very good communication skills in English and German

Your ZEISS Recruiting Team: Janina Kalmbach