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The Posting
Job Summary:
Seeking a Process Engineer with 3-5 years of semiconductor industry experience in Wafer Saw (Dicing), Blade Dicing, Backgrind, or DBG processes.
Job Responsibility
- Define/optimize procedures to ensure smooth processing of production lots
- Develop and maintain process documentation and SOPs including operator training
- Lead root cause analysis for defects and yield losses
- Provide disposition on lots with quality issues
- Support new product introduction and process qualification
- Analyze production data to identify process improvements
- Collaborate with cross-functional teams on cost reduction and process improvement projects
- Perform change management including new material qualification
Qualification
- Bachelor's or master's degree in Engineering (Electronics, industrial, Chemical, Mechanical, or related field).
- 3–5 years of process engineering experience with standard backgrind and dicing before grinding (DBG) process.
- Strong data analysis and problem-solving skills.
- Experience with Statistical Process Control (SPC) and process validation (preferred).
- With good command of English language.
- Knowledge of Lean, Six Sigma, or continuous improvement tools (advantage).
More information about NXP in Thailand...
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Facts
- Source
- Workday
- External id
- R-10063005-1
- Location
- Bangkok, Thailand
- Remote
- Not stated
- Employment
- Full time
- Posted
- 22 Sep 2026
- First seen
- 29 Oct 2026, 11:13
- Last seen
- 2 Nov 2026, 01:54
- Status
- Not yet added
- Posting id
- 41280425-67b2-565d-9e3a-571a09daa465