Senior Principal Foundry Engineer - HV/BCD Process Integration

Operations 3rd Party Foundries:

• Co-ordinate all Wafer Manufacturing related activities.
• Ensure available capacity is in place to cover both STP and LTP volumes. Taking into account type split and capacity bottlenecks.
• Drive BBSC for all 3rdParty Foundries for Delivery, through put time, Yield and Quality including follow up on improvement actions
• Monitor, review and manage any process changes/improvements supporting requests both from 3rd Party Foundries to BL’s and from BL’s to 3rd Party Foundries.

Co-ordinate and drive solutions to customer complaints hold lots and yield/processing excursions related to 3rdParty Foundry ensuring route cause is understood and corrective actions are in place.

Program management 3rdParty Foundries:

• Define time-line, resources, risk-mitigations (technical & non technical)activities to ensure timely and satisfactory completion of the project
• Be responsible for monitoring and controlling the execution of the project as per agreed time-line
• Drive all new product transfers activities in External Foundries with support of NXP project team (Innovation, mother fab, BL) and local project team of External Foundry
• Actively coordinate process qualification, product introduction and qualification
• Stimulate/oversee structural problems solving by use of statistical and quality tools
• Chair and organize process gate meetings
• Report to NXP stakeholders and External Foundries counterparts (PRB/Steering Committee)
• Be the interface between NXP and External Foundries during project execution
• Coordinate safe-launch and volume ramp-up implementation, monitor with support of the local technical team continuous yield & process improvement activities

General areas of responsibility include:

• Relation management and communication interface to all 3rdParty Foundries within their area.
• Drive Quarterly review with 3rdParty Foundries including follow up on actions
• Support Foundry Sourcing group in cost/price negotiations and discussions with both existing and new 3rd Party Foundries

Job Requirement:

Minimum Qualifications:

• Bachelor/Master in Engineering/Material Science/Electronic
• Minimum 7 years working experience preferably in semiconductor fab environment (Process Integration, Device/Yield engineer preferred)
• Well verse in English and Chinese. This role involves regular interaction with Mandarin-speaking suppliers. Therefore, fluency in spoken Mandarin is required to facilitate effective communication and stakeholder engagement.
• Able to work independently and also handle cross functional projects

Preferred Qualifications:

• Six sigma green belt and above, SPC knowledge, Semiconductor Devices and Process knowledge
• Knows statistical tool KLA ACE XP, JMP, SPS etc

More information about NXP in Singapore...

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