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WabtecErie, PA, US. Full-time.
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Electronic packagingPackaging designManufacturingMechanical PackagingDesign for Manufacturability (DFM)Industry best practicesThermal managementEMCActive and passive coolingBill of Materials (BOM)Technical design reviewValidation and QualificationBachelor’s degree in Mechanical EngineeringStructural and Thermal AnalysisAbility to travel
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