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Renesas ElectronicsTempe, AZ, United States. Full-time.

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Package designRenesasPackagingFlip-chip packagingMulti-chip moduleEmbedded SystemsPower device packagingOSATWafer level packagingPackage design rulesDegree in Physics, Chemistry, Mechanical, Electrical or Materials EngineeringAssembly processStatistical softwareInterpersonal SkillsU.S. export control regulations

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