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IntelPhoenix, AZ, United States. Full time.

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PackagingProduct designManufacturing processesReliability EngineeringManufacturingProblem solvingSemiconductor industryDesign for Manufacturability (DFM)Design of Experiments (DOE)Statistical process control (SPC)Material selectionPackaging designProcess DevelopmentTechnical risk managementSemiconductor Manufacturing

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